RF POWER AMPLIFIERS TECHNICAL REFERENCE MATERIAL
Empower RF employs a modular form of construction. Modules are cooled by conduction to a heatsink. The mounting surfaces are machined to 63 micro-inches and 1 mil per inch TIR. Thermal compound is applied to ensure minimum thermal resistance at the interface. Thermal overload protection is supplied on most amplifiers.
Cooling can be accomplished four ways:
- Conduction - The amplifier baseplate is mounted to the heatsink. The heatsink must be designed
such that the maximum specified baseplate temperature is not exceeded, normally +71°C.
- Convection - The amplifier contains a very large finned heatsink. The surface area is large enough
to dissipate the heat in a still air environment.
- Forced Air - Cooling air is directed through a finned heatsink in the amplifier.
- Liquid - The cooling fluid is pumped through a chill plate in the amplifier. The cooling heat exchanger is external to the amplifier.
Touch Screen Color LCD Controller & Remote Operation
Ver 3.93 Rev 3.3-3.8
Not applicable to "Next Generation" platform
RS485 Serial Communication Protocol Documment Number: 0034-0001 Rev. A
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