Engineering Notes
POWER RF AMPLIFIERS TECHNICAL REFERENCE MATERIAL
Cooling Methods
Empower RF employs a modular form of construction. Modules are cooled by conduction to a heatsink.
The mounting surfaces are machined to 63 micro-inches and 1 mil per inch TIR. Thermal compound is
applied to ensure minimum thermal resistance at the interface. Thermal overload protection is supplied on most
amplifiers.
Cooling can be accomplished four ways:
- Conduction - The amplifier baseplate is mounted to the heatsink. The heatsink must be designed
such that the maximum specified baseplate temperature is not exceeded, normally +71°C.
- Convection - The amplifier contains a very large finned heatsink. The surface area is large enough
to dissipate the heat in a still air environment.
- Forced Air - Cooling air is directed through a finned heatsink in the amplifier.
- Liquid - The cooling fluid is pumped through a chill plate in the amplifier.
The cooling heat exchanger is external to the amplifier.
NEED A SPECIFIC AMPLIFIER? VISIT EmpowerRF.com
|
EN Home
Using CCDF as a Method
of Measuring P1dB and P3dB
RF Glossary of Terms
Watts to dBm and dBm to Watts
Conversion Calculator
RF Amplifiers Gain
Passband Frequency Range Gain Flatness
RF Power
Pulsed Power
Peak Envelope Power
Harmonics & Spurious
Intercept Point
Intermodulation Distortion
Multitone IMD Monograph
Noise Figure & Level
Modulation Types
VSWR & Return Loss (Impedance)
Load VSWR & Protection
Leveling Loops, Input Overdrive Protection
Graceful Degradation
Protection Circuits
DC Input Power & Efficiency
Cooling Methods
Class of RF Amplifiers
Class A Operation
Class AB Operation
Class C operation
|
Quote Cart 
Login
Search
